发明名称 |
Antenna using through-silicon via |
摘要 |
An antenna includes a substrate and a top plate disposed over the substrate. At least one feed line is connected to the top plate, and each feed line comprises a first through-silicon via (TSV) structure passing through the substrate. At least one ground line is connected to the top plate, and each ground line comprises a second TSV structure passing through the substrate. The top plate is electrically conductive, and the at least one feed line is arranged to carry a radio frequency signal. The at least one ground line is arranged to be coupled to a ground. |
申请公布号 |
US8674883(B2) |
申请公布日期 |
2014.03.18 |
申请号 |
US201113114828 |
申请日期 |
2011.05.24 |
申请人 |
YEN HSIAO-TSUNG;LU JHE-CHING;LIN YU-LING;KUO CHIN-WEI;JENG MIN-CHIE;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YEN HSIAO-TSUNG;LU JHE-CHING;LIN YU-LING;KUO CHIN-WEI;JENG MIN-CHIE |
分类号 |
H01Q1/38 |
主分类号 |
H01Q1/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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