| 发明名称 |
Solder, soldering method, and semiconductor device |
| 摘要 |
A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight. |
| 申请公布号 |
US8673762(B2) |
申请公布日期 |
2014.03.18 |
| 申请号 |
US201113313349 |
申请日期 |
2011.12.07 |
| 申请人 |
AKAMATSU TOSHIYA;IMAIZUMI NOBUHIRO;SAKUYAMA SEIKI;UENISHI KEISUKE;NAKANISHI TETSUHIRO;FUJITSU LIMITED |
发明人 |
AKAMATSU TOSHIYA;IMAIZUMI NOBUHIRO;SAKUYAMA SEIKI;UENISHI KEISUKE;NAKANISHI TETSUHIRO |
| 分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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