| 摘要 |
The present invention relates to a semiconductor wafer manufacturing apparatus and a method thereof for filling up conductors in a via hole of a wafer. The present invention comprises: a wafer chuck for fixating and supporting the back side of the wafer in which the via hole is formed; a chuck rotating unit for rotating the wafer chuck; a chuck elevating unit for elevating the wafer chuck; an inner side treatment solution receiving unit for receiving treatment solution supplied to the wafer, formed to surround the wafer fixated on the wafer chuck when the wafer chuck is lowered by the chuck elevating unit; and an outer side treatment solution receiving unit formed to surround the wafer fixated on the wafer chuck on the outer wall of the inner side treatment solution receiving unit in order to receive treatment solution scattered from the wafer as the wafer chuck rotates by the chuck rotating unit when the wafer chuck is elevated to the upper side of the inner side treatment solution receiving unit by the chuck elevating unit. |
