发明名称 |
Semiconductor device, method for manufacturing the same, and power supply unit |
摘要 |
A method for manufacturing a semiconductor device includes placing a sheet containing a fibrous material having at least one outer surface having a metal on a semiconductor chip-mounting region of a substrate; forming a bonding layer containing a fusible metal on the semiconductor chip-mounting region; placing a semiconductor chip on the semiconductor chip-mounting region; and bonding the semiconductor chip to the semiconductor chip-mounting region with the fusible metal-containing bonding layer by heating. |
申请公布号 |
US8674520(B2) |
申请公布日期 |
2014.03.18 |
申请号 |
US201213355805 |
申请日期 |
2012.01.23 |
申请人 |
IMAIZUMI NOBUHIRO;OKAMOTO KEISHIRO;WATANABE KEIJI;FUJITSU LIMITED |
发明人 |
IMAIZUMI NOBUHIRO;OKAMOTO KEISHIRO;WATANABE KEIJI |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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