| 摘要 |
Provided is a method of producing a liquid ejection head substrate, the method including, in sequence; grinding a second surface of a silicon substrate, which is an opposite surface of a first surface on which a function element is formed, polishing the ground second surface, etching the polished second surface by reactive ion etching using ion incident energy, forming an etching mask on the second surface after the reactive ion etching, and forming a liquid supply port by subjecting the silicon substrate to wet etching using the etching mask. |
