| 发明名称 |
3D integrated circuits structure |
| 摘要 |
A structure of connecting at least two integrated circuits in a 3D arrangement by a metal-filled through silicon via which simultaneously connects a connection pad in a first integrated circuit and a connection pad in a second integrated circuit. |
| 申请公布号 |
US8674515(B2) |
申请公布日期 |
2014.03.18 |
| 申请号 |
US201213364002 |
申请日期 |
2012.02.01 |
| 申请人 |
FAROOQ MUKTA G.;IYER SUBRAMANIAN S.;KOESTER STEVEN J.;ZHU HUILONG;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FAROOQ MUKTA G.;IYER SUBRAMANIAN S.;KOESTER STEVEN J.;ZHU HUILONG |
| 分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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