发明名称 |
Heat radiation component and semiconductor package including same |
摘要 |
A heat radiation component configured to be provided through a thermal interface material on a semiconductor device mounted on a board includes a first layer to be positioned on a first side and a second layer stacked on the first layer to be positioned on a second side farther from the semiconductor device than the first side. The coefficient of thermal expansion of the second layer is lower than the coefficient of thermal expansion of the first layer. |
申请公布号 |
US8674499(B2) |
申请公布日期 |
2014.03.18 |
申请号 |
US201113114188 |
申请日期 |
2011.05.24 |
申请人 |
MURAYAMA KEI;SUGANUMA SHIGEAKI;KITAJIMA MASAKUNI;MATSUKI RYUICHI;MIYAJIMA HIROYUKI;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA KEI;SUGANUMA SHIGEAKI;KITAJIMA MASAKUNI;MATSUKI RYUICHI;MIYAJIMA HIROYUKI |
分类号 |
H01L23/34;H01L21/00;H01L23/10 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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