| 摘要 |
<p>PURPOSE: A semiconductor device including a warpage preventing structure is provided to prevent a non-wet phenomenon by forming a restricting device between a substrate and a bottom chip. CONSTITUTION: A bottom chip (20) is conductively attached to a substrate (10) by a first conductive connector (24). The bottom chip functions as an interposer. A top chip (30) is conductively attached to a through silicon via (22) of the bottom chip by a second conductive connector (26). A restricting device (40) restricts the bottom chip. The restricting device is adopted as thermosetting nonconductive paste (40a).</p> |
