| 摘要 |
PURPOSE: A sputter apparatus is provided to includes a contamination preventing unit that is provided in a substrate transferring roller so as to prevent a deposition material from being transferred to the lower surface portion of substrate on which a film is not formed along the outer surface of substrate transferring roller, thereby preventing the lower surface portion of substrate from being contaminated by the deposition material. CONSTITUTION: A sputter apparatus includes a process chamber (100), a plurality of substrate transferring roller (200), and a contamination preventing unit (300). The deposition process is performed in the process chamber for a plurality of substrates (S) that is transferred by spacing by the predetermined distance. The contamination preventing unit is provided on the substrate transferring roller, and prevents the substrate from being contaminated by transferring the deposition material to the lower surface portion of the substrate along the outer circumference surface of the substrate transferring roller. |
