JIG FOR FORMING CIRCUITS OF CIRCUIT-SUBSTRATES, AND CIRCUIT-SUBSTRATES MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve productivity of circuit patterns and heat dissipation patterns by conducting a manufacturing process in which multiple circuit-substrates are two-dimensionally arranged into one jig, when forming the circuit pattern and the heat dissipation pattern of the circuit-substrate.SOLUTION: In a multiple circuit-substrates arranging jig which performs alignment for circuit formation, around the jig to be set with substrates thereinto, respective thin plate-shaped elastic bodies are provided. The multiple circuit-substrates arranging jig includes a plurality of fitting parts so as to move a substrate center position to a jig center position simultaneously upon mounting the substrate to the jig by causing horizontal pressure from the elastic bodies in the same height to the center of the jig to act from counter sides. A circuit-substrate manufacturing method using the multiple circuit-substrates arranging jig is also disclosed.