| 摘要 |
PROBLEM TO BE SOLVED: To increase reliability in component mounting when mounting the component by using a solder resist layer.SOLUTION: A wiring board manufacturing method comprises: preparing each of a resist with resin composed of a film solder resist and a resin film formed on one surface of the solder resist, and a substrate having a conductor pattern on a surface (steps S11, S12); arranging the film solder resist on the conductor pattern in a semi-cured state (step S13); thrusting the solder resist to the substrate by applying pressure to the resin film to firmly attach the solder resist and the substrate to each other (step S14); peeling off the resin film from the solder resist (step S16); forming an opening in the solder resist to expose a part of the conductor pattern (step S17); and finally curing the solder resist (step S18). |
