| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensitive tape affixing method and a pressure sensitive tape affixing device in which a pressure sensitive tape for support is accurately affixed to a corresponding side of a wafer including an annular protrusion in the outer circumference thereof.SOLUTION: A band-like pressure sensitive tape T which is wider than an outer shape of a ring frame (f), is affixed to the ring frame (f) while applying a tension in a length direction and a width direction of the pressure sensitive tape T. The pressure sensitive tape T between the ring frame (f) and the wafer W is held between a pair of housings, thereby forming a chamber. Pressure in a space at a side where the wafer W is accommodated, partitioned by the pressure sensitive tape T is reduced rather than that in the other space, and the pressure sensitive tape T is affixed to an annular protrusion formed in the outer circumference of the wafer W and a flat surface inside of the annular protrusion. |
