发明名称 |
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board achieving high packaging reliability, and to provide an electronic device and an electronic module which use the wiring board.SOLUTION: A wiring board 1 of the invention includes: an insulation substrate 2; and an external electrode 3. The insulation substrate 2 has a lower surface 2a. A recessed part 4 is formed on the lower surface 2a. The external electrode 3 is provided on the lower surface 2a. The insulation substrate 2 has a protruding part 5 at the recessed part 4. |
申请公布号 |
JP2014049482(A) |
申请公布日期 |
2014.03.17 |
申请号 |
JP20120188849 |
申请日期 |
2012.08.29 |
申请人 |
KYOCERA CORP |
发明人 |
KOHAMA KENICHI;FUNAHASHI AKIHIKO |
分类号 |
H01L23/12;G01P15/08;H01L23/13;H05K1/18 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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