发明名称 WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board achieving high packaging reliability, and to provide an electronic device and an electronic module which use the wiring board.SOLUTION: A wiring board 1 of the invention includes: an insulation substrate 2; and an external electrode 3. The insulation substrate 2 has a lower surface 2a. A recessed part 4 is formed on the lower surface 2a. The external electrode 3 is provided on the lower surface 2a. The insulation substrate 2 has a protruding part 5 at the recessed part 4.
申请公布号 JP2014049482(A) 申请公布日期 2014.03.17
申请号 JP20120188849 申请日期 2012.08.29
申请人 KYOCERA CORP 发明人 KOHAMA KENICHI;FUNAHASHI AKIHIKO
分类号 H01L23/12;G01P15/08;H01L23/13;H05K1/18 主分类号 H01L23/12
代理机构 代理人
主权项
地址