| 摘要 |
A substrate processing device includes a substrate holding part including a through hole having a first size evenly formed in the whole area from the central part to surrounding parts and facing a side of a substrate on which an organic thin film pattern is formed when the substrate is transferred while the other side of the substrate is going downwardly, a substrate support part moving up and down through the through hole while having a second size smaller than the first size, supporting the other side of the substrate by moving up when the other side faces the holding part, and attaching the other side of the substrate to the holding part by moving down while supporting the other side, and an arranging part moving the substrate holding part in a moving range in the through hole having the first size in order to arrange a gap between the support part and the substrate supported by the support part when the other side is attached to the support part. [Reference numerals] (17) Arranging part; (19) Sub arranging part |
