| 摘要 |
<p>PURPOSE: A manufacturing method of a lead frame and a package manufacturing method thereof are provided to simplify the manufacturing process of a semiconductor package by removing a plurality of tie bars during a lead frame manufacturing process. CONSTITUTION: A lead frame(107) comprises a die pad(121), a plurality of lands, a plurality of tie bars, and a plurality of edge parts. A plurality of tie bars supports a plurality of lands. A plurality of edge parts supports a plurality of tie bars. The lower part of a plurality of tie bars is etched to specific thickness. An empty space between the lower part of a plurality of tie bars, a plurality of lands, and the die pads are filled with a resin(611). A plurality of tie bars are removed.</p> |
