| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of communication modules which efficiently radiates heat generated in the communication modules even when the communication modules are disposed in high density, and to provide a communication device.SOLUTION: A cooling structure of optical modules 2 serving as communication modules includes: a heat sink 6 including a body part 60 which is cooled by a cooling mechanism and a cool storage part 61 where multiple slit shaped storage spaces 610 are formed between multiple partition walls 611. The multiple optical modules 2, each of which includes a first side wall 201 and a second side wall 202 sandwiching a substrate, on which a circuit component for communication is mounted, in a thickness direction of the substrate, are respectively stored in the storage spaces 610 of the cool storage part 61. At least the first side wall 201 of each optical module 2 makes surface contact with a first inner surface 610a of the storage space 610. |
