发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a pattern with reduced development unevenness can be formed.SOLUTION: The photosensitive resin composition comprises: (A) a binder resin; (B) a polymerizable compound expressed by formula (I); and (C) a photopolymerization initiator. In formula (I), R, Rand Rrepresent a hydrogen atom or a methyl group; and X represents -R-O-R-, where Rrepresents a single bond or an alkylene group having 1 to 5 carbon atoms and Rrepresents an alkylene group having 1 to 3 carbon atoms and having a hydroxyl group.
申请公布号 JP2014048556(A) 申请公布日期 2014.03.17
申请号 JP20120192903 申请日期 2012.09.03
申请人 SUMITOMO CHEMICAL CO LTD 发明人 MIURA HIROYUKI
分类号 G03F7/027;C08F2/46;C08F20/20;G02B5/20;G02B5/22;G03F7/004;G03F7/031;H01L21/027 主分类号 G03F7/027
代理机构 代理人
主权项
地址