| 摘要 |
PROBLEM TO BE SOLVED: To provide a sticky adhesive film in which suppression of adhesion transfer of a sticky adhesion layer and securement of peel strength with a substrate film can be combined by a simple configuration; and a production method of a semiconductor device using the same.SOLUTION: In a sticky adhesive film 1, tack strength FA of a one side face 13A that faces to a side of a substrate film 11 and tack strength FB of other side face 13B that faces to an opposite side of a side of the substrate film 11 satisfy FA>FB and 10 gf≤FB≤800 gf. Thereby, while peel strength of a sticky adhesion layer 13 and the substrate film 11 is secured, suppression of generation of adhesion transfer of the sticky adhesion layer 13 to a dicing frame 22 can be performed. Moreover, a different component is not used to the sticky adhesive film 1, thereby configuration does not become complicate, and cost reduction is achieved. |
