| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive adhesive composition that is used for an electrode of a through hole or a via hole of a printed circuit board and has low resistance, high adhesion, and is excellent in storage stability, and to provide a semiconductor device using the electroconductive adhesive composition.SOLUTION: The electroconductive adhesive composition is a conductive adhesive which contains: a silver coated metal powder (A); an epoxy resin compound (B); a phenol resin compound (C); and a hardening accelerator (D) as essential components. The silver coated metal powder (A) is obtained by coating a surface of a metal particle having an average grain diameter of 1-10 μm with silver, and has a ratio of silver to the total amount of the metal particle and silver of 0.5-30 wt.%, and has a tap density of 3-8 g/cm. The epoxy resin compound (B) has a viscosity at 25°C of 3 Pa s or less. The electroconductive adhesive composition contains each component in such an amount that the silver coated metal powder (A) is 70-95 wt.% to the total amount, the phenol resin compound (C) is 10-60 pts.wt. to the epoxy resin compound (B), and the hardening accelerator (D) is 0.05-5 pts.wt. to the epoxy resin compound (B). |
