发明名称 COOLING STRUCTURE OF SHUNT RESISTOR AND INVERTER DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To mount a surface mounting type shunt resistor on the solder surface side of a circuit board and use a heat radiator used in a conventional inverter device for cooling the shunt resistor.SOLUTION: A cooling structure of a shunt resistor includes: a shunt resistor 4 which is surface-mounted on a solder surface of a circuit board 7 with a semiconductor switching element 1 mounted on a component surface of the circuit board 7; a heat radiator 9 which radiates heat generated by the semiconductor switching element 1 and the shunt resistor 4; and an insulation material 8 which is disposed between the shunt resistor 4 and the heat radiator 9 and has high heat conductivity.
申请公布号 JP2014049516(A) 申请公布日期 2014.03.17
申请号 JP20120189433 申请日期 2012.08.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 SAOTOME HIDEYUKI;MUTO TAKAYA
分类号 H01C1/084;H01C1/082;H01L23/36;H02M7/48;H05K7/20 主分类号 H01C1/084
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