发明名称 |
COOLING STRUCTURE OF SHUNT RESISTOR AND INVERTER DEVICE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To mount a surface mounting type shunt resistor on the solder surface side of a circuit board and use a heat radiator used in a conventional inverter device for cooling the shunt resistor.SOLUTION: A cooling structure of a shunt resistor includes: a shunt resistor 4 which is surface-mounted on a solder surface of a circuit board 7 with a semiconductor switching element 1 mounted on a component surface of the circuit board 7; a heat radiator 9 which radiates heat generated by the semiconductor switching element 1 and the shunt resistor 4; and an insulation material 8 which is disposed between the shunt resistor 4 and the heat radiator 9 and has high heat conductivity. |
申请公布号 |
JP2014049516(A) |
申请公布日期 |
2014.03.17 |
申请号 |
JP20120189433 |
申请日期 |
2012.08.30 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
SAOTOME HIDEYUKI;MUTO TAKAYA |
分类号 |
H01C1/084;H01C1/082;H01L23/36;H02M7/48;H05K7/20 |
主分类号 |
H01C1/084 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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