THERMOSETTING RESIN SHEET FOR ELECTRONIC COMPONENT SEALING, RESIN-SEALED SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin sheet for electronic component sealing improved in adhesion with an electronic component, a high-reliability resin-sealed semiconductor device, and a manufacturing method thereof.SOLUTION: In a thermosetting resin sheet for electronic component sealing, the content of thermosetting resins with respect to an entire resin component is 30 wt% or less, and a shear adhesive strength after adhesion to a silicon-nitride film formed on a silicon wafer and setting is 15 MPa or more at 25°C and 2 MPa or more at 260°C. The shear adhesive strength after adhesion to a copper plate and setting is 10 MPa or more at 25°C and 0.5 MPa or more at 260°C, and the shear adhesive strength after adhesion to a glass cloth substrate epoxy resin and setting is 10 MPa or more at 25°C and 1 MPa or more at 260°C.