| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an electronic element with excellent airtightness, and an electronic device.SOLUTION: A package for housing an electronic element comprises: a base substrate 1 on the upper face of which a recess 1a for housing an electronic element 4 is formed; and a window plate 2 jointed to a circumference of the recess 1a of the base substrate 1 and air-tightly sealing the recess 1a. A principal plane of the window plate 2 has a polygonal shape, and the window plate 2 has a metallic layer 3 on an outer periphery of the principal plane. The metallic layer 3 is wound along an outer periphery of the window plate 2 and away from corners 2a of the principal plane of the window plate 2 at the corners 3a, and has thin parts 3b with small thickness at the corners 3a. Therefore, sealability at the corners 3a can be improved. |
