| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an electronic element with improved jointing reliability of a window material, and an electronic device.SOLUTION: A package for housing an electronic element comprises: a base substrate 1 on the upper face of which a recess 1a for housing an electronic element 4 is formed; and a window plate 2 jointed to a circumference of the recess 1a of the base substrate 1 and air-tightly sealing the recess 1a. A principal plane of the window plate 2 has a polygonal shape, and a metallic layer 3 surrounding an outer periphery of the principal plane and having a thin part 3a with small thickness at one part is formed on the window plate 2. Thickness of a jointing material for jointing the window plate 2 is changed, and therefore, jointing reliability of the window plate 2 to the base substrate 1 can be improved. |
