| 摘要 |
PURPOSE: A lead frame, a method for manufacturing the same, a semiconductor package using the same and a method for manufacturing the semiconductor package are provided to form a surface treatment layer with a hydrophobic property using a dry plasma discharge method. CONSTITUTION: A die pad(110) is arranged on the center of a lead frame(100). A semiconductor chip is loaded on the die pad. A plurality of leads(120) includes internal leads(130) and external leads(140). A dam bar(160) supports the leads and secure the gap between the leads. A side rail(170) supports the die pad and the leads. A support unit(180) is connected to the die pad by the side rail and support the die pad. |
