| 摘要 |
<p>The present invention provides a delamination system for improving a processing rate. The delamination system according to an embodiment of the present invention delaminates a polymerized substrate in which a first substrate and a second substrate are attached into the first substrate and the second substrate. The delamination system includes a first processing block processing the polymerized substrate or the first substrate after delamination and a second processing block processing the second substrate after the delamination. The first processing block includes a delamination station in which a delamination device which delaminates the polymerized substrate, transferred by a first transferring unit, into the first substrate and the second substrate is installed. The second processing block includes a second washing station and a transmission station. The second washing station includes a second washing device washing the second substrate after the delamination. The transmission station is arranged between the second washing station and the delamination station and receives the second substrate from the delamination station after the delamination and transmits the second substrate to the second washing station. [Reference numerals] (60) Control device</p> |
