| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing apparatus and a wafer processing method, in which a wafer processing defect can be prevented from being generated by contamination in an end portion of a wafer.SOLUTION: In first and second processing blocks 12 and 13, conveyer mechanisms 127, 137 are provided, respectively. Each of the conveyer mechanisms 127, 137 includes a hand. The hand holds another side of a wafer W without being brought into contact with an end portion of the wafer W. By moving the hand, the wafer W is conveyed between an adhesion strengthening processing unit PAHP or a cooling unit CP and an application processing unit 129 or a development processing unit 139. In the adhesion strengthening processing unit PAHP and the cooling unit CP, temperature processing is performed on the wafer W while adsorbing and holding a rear face of the wafer W. In the application processing unit 129 and the development processing unit 139, a processing liquid is supplied to a principal face of the wafer W while adsorbing and holding the rear face of the wafer W through a spin chuck. |
