| 摘要 |
PROBLEM TO BE SOLVED: To attain high reliability at a joint using a solder, by a simple manufacturing method.SOLUTION: At first, the temperature is raised up to a preheat temperature (region I: temperature rise step). Subsequently, the preheat temperature is held for 50-120 seconds (region II: preheat step). The preheat temperature is lower than the setting temperature (180°C) of epoxy resin by 20-40°C, and is about 150°C in this case. Thereafter, a peak temperature is set in a range of 260-280°C, e.g., 250°C, higher than the melting point (220°C) of metal particles (solder) 52, and it is held for 30-50 seconds (region III: melting step). In this manufacturing method, flux surrounds the outer periphery of a semiconductor chip in uncured state, in the preheat step. Subsequently, in the melting step, the metal particles in congestion state are melted and fused. |
