| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head in which possibility that bonding material comes out from between a heat sink and a substrate can be reduced.SOLUTION: A thermal head X1 includes: a substrate 7 having a heating part 9; a heat sink 1 to mount the substrate 7; and a bonding material 10 to connect the substrate 7 with the heat sink 1. The heat sink 1 has a protrusion part 2 protruding toward the substrate 7 at an end part. The protrusion part 2 has an inclined area R in which a clearance between the substrate 7 and the protrusion part 2 becomes larger toward a central part of the heat sink 1, and is connected with the substrate 7 via the bonding material 10 at the inclined area R. |
