WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To improve adhesion between a through conductor and a wiring conductor layer, and to provide a wiring board with excellent connection reliability.SOLUTION: A wiring conductor layer 23 and a through hole 26 continuously penetrating resin insulating layers 21 and 22 are formed on a wiring board 10 for electronic component inspection. A via conductor 27 connected to the wiring conductor layer 23 is formed by filling the through hole 26 with a conductive paste. A through hole 26 portion penetrating the wiring conductor layer 23 includes a small diameter hole 51 located on surface sides of the resin insulating layers 21 and 22 and formed by an inner wall surface of the wiring conductor layer 23 and a large diameter part 52 provided in a position more away from surfaces of the resin insulating layers 21 and 22 than the small diameter part 51 and formed so that a diameter of the inner wall surface of the wiring conductor layer 23 is enlarged to the small diameter part 51.