| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensitive tape affixing method and a pressure sensitive tape affixing device, in which a pressure sensitive tape can be affixed accurately regardless of a state of a circuit formation side of a semiconductor wafer and characteristics of the pressure sensitive tape.SOLUTION: A pressure sensitive tape PT larger than an outer shape of a pair of lower housings 33B constituting a chamber 7 is affixed to a junction of the housings and the pressure sensitive tape is held between the lower housings and an upper housing 33A, thereby configuring the chamber 7. While making atmospheric pressure in a space closer to a wafer W which is disposed while proximately facing a pressure sensitive side of the pressure sensitive tape PT lower than that in the other space, the pressure sensitive tape is then affixed to the wafer W. A surface of the pressure sensitive tape PT affixed to a circuit formation side of the wafer W is flattened by being pressurized with a flat face of a pressurizing member 61. Pressurizing processing of the pressure sensitive tape surface is selectively performed in accordance with a circuit state of the wafer W and characteristics of the pressure sensitive tape PT. |
