发明名称 Fremgangsmåde til fremstilling af en miniatureforstærker og signalbehandlingsenhed
摘要 <p>A method for producing miniature amplifier and signal processing unit includes the steps of: producing arrays of individual integrated circuits on a side of a wafer, where each circuit has a number of I/O connection points; providing a number of solder connection pads at each integrated circuit for redistribution of the I/O connection points of the integrated circuit; coating the side of the wafer having the solder connection pads with a protection coating and ensuing through going apertures in the coating to provide electrical contact with the solder connection pads; applying electrical components onto the coating and gaining electrical contact with the solder connection pads through the apertures of the coating material; and singulating the individual amplifiers from the wafer and ensuring light protection of the edges and possible unprotected side of the amplifiers.</p>
申请公布号 DK1402572(T3) 申请公布日期 2014.03.17
申请号 DK20020748619T 申请日期 2002.06.14
申请人 OTICON A/S 发明人 SKINDHOEJ, JOERGEN;PETERSEN, ANDERS, ERIK
分类号 H01L21/78;H01L25/00;H01L21/50;H01L21/56;H01L21/68;H01L21/683;H01L23/00;H01L23/31 主分类号 H01L21/78
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