| 摘要 |
PROBLEM TO BE SOLVED: To inhibit defects caused by a short-circuit between a wire for a semiconductor chip in an upper stage and a wire for a semiconductor chip in a lower stage in a mold process of a semiconductor device in which semiconductor chips of the same kind are stacked on a wiring board in a step-like manner.SOLUTION: A semiconductor device manufacturing method comprises a mold process of stacking a plurality of semiconductor chips of the same kind each of which has a plurality of bonding pads which are formed along a first edge and have metal layers on surfaces in a step-like manner, respectively, and connecting the other end of a wire connected to the bonding pad of the semiconductor chip in an upper stage to a bonding lead of the wiring board without being routed through the bonding pad of the semiconductor chip in a lower stage. In the mold process, an encapsulation resin is supplied from a second edge side opposite to the first edge toward the first edge side. |
