发明名称 MANUFACTURING METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate having a sufficiently reduce resistance stably.SOLUTION: In a method for manufacturing a substrate having a predetermined conductive pattern, a solvent containing at least one of water and an organic solvent, and a conductive ink containing metal particles, and an insulating polymer are applied to a predetermined region of a substrate 11. A patterning device 31 electrifies the region while applying a tension to the substrate 11, and fuses the metal particles by generating heat from the region, thus forming a conductive pattern.
申请公布号 JP2014049617(A) 申请公布日期 2014.03.17
申请号 JP20120191493 申请日期 2012.08.31
申请人 FURUKAWA CO LTD 发明人 YOSHIDA TATSUFUMI;HARAKO AKIRA;YAMAMOTO KAZUTOMI
分类号 H05K3/12;H05K3/10 主分类号 H05K3/12
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