| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can transfer heat generated by a semiconductor package to a heat sink with high efficiency and improve a performance and reliability of a microwave amplifier and the like at low cost.SOLUTION: A semiconductor device comprises a semiconductor package 3 which is mounted on a heat sink 2 and houses heat generation members 10 including a semiconductor element 7 and elements around the semiconductor element 7, and a sheet-like heat release spacer 4 which has high heat transfer performance and is sandwiched between the semiconductor package 3 and the heat sink 2. The semiconductor package 3 has a heat generation region 11 in which the heat generation members 10 are arranged on a base plate 5, and attachment notches 12 for screw clamp with the heat sink 2 are arranged on flange parts 5a, 5b of the base plate 5 outside the heat generation region 11. The heat release spacer 4 has uplift prevention means 17 for preventing uplifting which occurs between contact faces of the heat sink 2 and the heat generation region 11 of the semiconductor package 3 when the semiconductor package 3 is screwed and fixed to the heat sink 2. |
