发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device by preventing an adhesive from flowing into an interface between a semiconductor element and a cover member.SOLUTION: A semiconductor device comprises: a substrate mounted with a semiconductor element on a surface thereof; an adhesive arranged around a region in which the semiconductor element is mounted on the surface of the substrate and including an extention part extending along a side of the semiconductor element; and a cover member including a first surface arranged to cover the semiconductor element and in contact with the adhesive, and a protrusion provided at a position corresponding to a tip part of the extension part on the first surface. |
申请公布号 |
JP2014049689(A) |
申请公布日期 |
2014.03.17 |
申请号 |
JP20120193337 |
申请日期 |
2012.09.03 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
IHARA TAKUMI;SHIMIZU ATSUKAZU |
分类号 |
H01L23/12;H01L23/34 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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