| 摘要 |
A wireless multi-chip module includes a lead frame structure (10) having parts for receiving a flip-chip mounted die, an IC (20) for forming a half-bridge circuit capsulated by a molding compound (70), and upper side and lower side MOSFETs. The module is assembled without any bond wire. The module may include passive components which include an external input capacitor (150) or an inner input capacitor (350). |
