| 摘要 |
PROBLEM TO BE SOLVED: To provide a joint method in which a residual stress or residual distortion is reduced and a joint strength is improved without interposing an adhesive material such as an adhesive or a solder between junctions and without using a polishing technique such as CMP or cutting processing for at least one junction as means for flattening a joint surface.SOLUTION: A joint method for joining rough surface junctions with each other, where root-mean-square roughness of each surface exceeds 1 nm, or joining the rough surface junction and a flat junction where root-mean-square roughness of a surface is equal to or less than 1 nm, includes: a flattening step of flattening the surface of the rough surface junction by pressurizing the junction surface in contact with a flat surface under heating; an activation processing step of performing activation processing on at least one junction surface; and a joint step of joining the surfaces of the junctions in contact with each other at normal temperature or at a temperature lower than a heating temperature in flattening. |
