| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a pattern can be formed at a low temperature.SOLUTION: The photosensitive resin composition comprises: a binder resin (A); a polymerizable compound (B) expressed by formula (I); and a photopolymerization initiator (C) expressed by formula (II). In the formulae, R1 represents a hydrogen atom or a methyl group; and * represents a bond. |
