MANUFACTURING METHOD OF RIGID FLEXIBLE PRINTED CIRCUIT BOARD

摘要

The present invention relates to a method for manufacturing a rigid flexible printed circuit board, which includes the following steps of: (a) attaching a form tape to a flexible part of an FCCL substrate which has an inner circuit part and is divided into a rigid part and the flexible part; (b) laminating a CCL substrate by using a normal type PPG in the outside of the FCCL substrate; (c) laminating multiple circuit layers by using the normal type PPG in the outside of the CCL substrate; (d) performing a cavity process to the flexible part to which the form tape of the (a) step is attached; (e) removing the outer layer of the form tape which is processed by the cavity process; and (f) removing the form tape after making the form tape form by heat of high temperature.