| 摘要 |
An encapsulant composition for electronic materials is provided to increase gas and water blocking property, excellent leveling property and surface hardness and to obtain a transparent multilayer plastic substrate. An encapsulant composition for electronic materials comprises (a) at least one selected between glass flake and nano-sized silica, (b) an epoxy resin and (c) a photoinitiator. The encapsulant composition is for hardcoating and includes at least one kind of nano-sized inorganic particles elected between nanoclay and glass bead. The refractive index of the glass flake is in a range of 1.50~1.60. The epoxy resin comprises at least one selected from cycloaliphatic, modified cycloaliphatic and hybrid resin system. The photoinitiator is at least one selected from sulfonium salts and ferrocenium salts. |
