EXTREMELY MICROSTRUCTURE CIRCUIT BOARD

摘要

The present invention relates to an ultrafine circuit board with an integrated non-conductive material-filled part and conductive circuit part and a manufacturing method thereof. In the present invention, the non-conductive material-filled part and the conductive circuit part are integrated in the upper part of a non-conductive supporting board, the non-conductive material-filled part is formed on the non-conductive supporting board, and the non-conductive material-filled part is formed between circuits in the conductive circuit part. A conductive layer which is formed on the non-conductive supporting board by sputtering is plated with a conductive metal. A manufacturing method of the ultrafine circuit board with an integrated non-conductive material-filled part and conductive circuit part comprises a photoresist-spreading process spreading photoresist onto the non-conductive supporting board with a thin conductive layer; an exposure process forming an exposed part and unexposed part by irradiating the photoresist with light through a patterned film; an etching process forming a space part by removing the unexposed part and removing the exposed thin conductive layer on the bottom of the formed space part; a non-conductive material-filling process filling the space part with non-conductive materials; an exposed part-removing process forming a space part by removing the exposed part in order to exposed the thin conductive layer on the bottom of the exposed part; and a circuit part-forming process forming the conductive circuit part by plating the space part with removed exposed part.