| 摘要 |
The invention provides a CU-Ti system copper alloy plate with high strength, excellent bending processability, stress relaxation resistance and improved resilience. The copper alloy plate is characterized by comprising the following components in percentage by weight: 1.0-5.0 percent of Ti, more than one of Fe which is below 0.5 percent, Co which is below 0.1 percent and Ni which is below 1.5 percent based on requirements, or more than one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in a proper range, and the balance of Cu and unavoidable impurities. The copper alloy plate meets the following formula (1) that I(420)/I0(420) is more than1.0, and preferentially meets the crystallization orientation of the following formula (2) that I(220)/I0(220) is not more than 3.0. The average crystal grain size is regulated to be 10-60 micrometers. |
