MULTI-LAYERED CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to multi-layered ceramic capacitor and a manufacturing method thereof. The multi-layered ceramic capacitor according to the present invention includes: a lower laminating part which corresponds to the 1/3 of the thickness of a whole chip and has the multi-layered laminating structure of a first sheet having a predetermined thickness; a central laminating part which is positioned in the upper part of the lower laminating part, corresponds to the 1/3 of the thickness of the whole chip, and has the multi-layered laminating structure of a second sheet which is relatively thicker than the lower laminating part; and an upper laminating part which is positioned in the upper part of the central laminating part, corresponds to the 1/3 of the thickness of the whole chip, and has the multi-layered laminating structure of the first sheet which is same as the lower laminating part, wherein the application rate of the central laminating part is 7-20% of the whole laminating structure. The present invention is able to remarkably reduce the short rate of an electrode by releasing the aggregation phenomenon of an internal electrode which is caused by an overheating because a laminating part is formed by laminating the central part of a chip laminating structure with a sheet which is relatively thicker than the upper and lower parts of the laminating structure. [Reference numerals] (AA) Sheet 2 (heterogeneous sheet)