| 摘要 |
#CMT# #/CMT# The device (14) has a connection plate (51) including an electrically conductive layer (68) that is in contact with a lower planar surface (66) of the plate. The conductive layer forms an additional current flowing plane (P3) that is parallel to first and second current flowing planes (P1, P2) formed by other electrically conductive layers (36, 44), where flow direction (I3) of current in the additional plane is identical to flow direction (I1) of the current in the first plane. An electric connector (48) ensures connection between the first and second planes. #CMT# : #/CMT# The electric connector is formed of a copper plate. #CMT#USE : #/CMT# Electrical interconnection device for use in an electronic system (claimed) i.e. alternating-current inverter, for connection of an electronic component e.g. diode or insulated gate bipolar transistor, with a power supply source i.e. direct-current voltage source. Can also be used in a rectifier or direct-current converter. #CMT#ADVANTAGE : #/CMT# The design of the interconnection device decreases the value of the parasitic inductance of a current circulation loop between terminals connected to the first and second current flowing planes so as to allow switching of the electronic components in a rapid manner, while reducing overvoltage and oscillations in an electronic system. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a side view of an electronic system with electrical connection substrates for electronic components. I1-I3 : Current flow directions P1, P2 : Current flowing planes P3 : Additional current flowing plane 14 : Electrical interconnection device 36, 44, 68 : Electrically conductive layers 48 : Electric connector 51 : Connection plate 66 : Lower planar surface. |
