发明名称 HIGH DURABILITY THERMALLY CONDUCTIVE COMPOSITE AND LOW PUMP-OUT GREASE
摘要 Provided is a high durability thermally conductive composite containing 0.5-10 volume % of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25 DEG C. of 10000-15000 Pa·s, 1-10 volume % of an alkylalkoxysilane, and 40-65 volume % of an inorganic filler with the remainder being an addition-reacting low molecular weight silicone with viscosity at 25 DEG C. of 0.2-0.5 Pa·s. Also provided is a grease characterized in containing 38-48 volume % of an addition-reacting low molecular weight silicone with viscosity at 25 DEG C. of 0.2-0.5 Pa·s, 2-8 volume % of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25 DEG C. of 10000-15000 Pa·s, and 50-60 volume % of an inorganic filler. It is preferable that the alkylalkoxysilane is a triethoxysilane or trimethoxysilane wherein the number of carbons in the alkyl groups is six to ten.
申请公布号 KR20140032348(A) 申请公布日期 2014.03.14
申请号 KR20137012457 申请日期 2011.11.18
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 DOHMOTO TAKASHI;OSHIMA KAZUHIRO;YAMAGATA TOSHITAKA
分类号 C10M113/06;C10M107/50;C10M119/04;C10M125/10;C10M125/20;C10M169/02 主分类号 C10M113/06
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