发明名称 |
HIGH DURABILITY THERMALLY CONDUCTIVE COMPOSITE AND LOW PUMP-OUT GREASE |
摘要 |
Provided is a high durability thermally conductive composite containing 0.5-10 volume % of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25 DEG C. of 10000-15000 Pa·s, 1-10 volume % of an alkylalkoxysilane, and 40-65 volume % of an inorganic filler with the remainder being an addition-reacting low molecular weight silicone with viscosity at 25 DEG C. of 0.2-0.5 Pa·s. Also provided is a grease characterized in containing 38-48 volume % of an addition-reacting low molecular weight silicone with viscosity at 25 DEG C. of 0.2-0.5 Pa·s, 2-8 volume % of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25 DEG C. of 10000-15000 Pa·s, and 50-60 volume % of an inorganic filler. It is preferable that the alkylalkoxysilane is a triethoxysilane or trimethoxysilane wherein the number of carbons in the alkyl groups is six to ten. |
申请公布号 |
KR20140032348(A) |
申请公布日期 |
2014.03.14 |
申请号 |
KR20137012457 |
申请日期 |
2011.11.18 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
DOHMOTO TAKASHI;OSHIMA KAZUHIRO;YAMAGATA TOSHITAKA |
分类号 |
C10M113/06;C10M107/50;C10M119/04;C10M125/10;C10M125/20;C10M169/02 |
主分类号 |
C10M113/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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