SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor device includes a lamination structure of an insulating capping line and a conductive line extended in a first direction on a substrate; contact plugs which have a sidewall facing the conductive line with air spacers therebetween and arranged in a line in the first direction; and a support which has a width varying according to a position in the first direction and formed between the contact plugs and the insulating capping line in order to define the height of the air spacer.