<p>A digital isolator, including: integrated circuit portions mutually spaced on a single electrically insulating die; an isolation barrier disposed between the integrated circuit portions to provide galvanic isolation therebetween; at least one coupling structure configured to provide signal coupling between the galvanically isolated integrated circuit portions; and mutually spaced electrodes on which the die is mounted, the electrodes being arranged below respective ones of the integrated circuit portions to improve common-mode transient immunity of the isolator.</p>
申请公布号
WO2014036594(A1)
申请公布日期
2014.03.13
申请号
WO2013AU00989
申请日期
2013.09.02
申请人
THE SILANNA GROUP PTY LTD
发明人
MOGHE, YASHODHAN, VIJAY;HAYTER, RUSSELL, GLEN;TENG, ANNETTE;SHARP, SARAH, JANE