The present invention relates to a microstructure circuit board in which a conductive circuit part and a pillar part are integrally combined. The microstructure circuit board in which a conductive circuit part and a pillar part are integrally combined comprises the pillar part and conductive circuit part integrally formed on one surface of a nonconductive support plate. The pillar part is formed between the circuits of the conductive circuit part. The pillar part and conductive circuit part are attached through the conductive support plate and an adhesive material. A manufacturing method for the microstructure circuit board in which a conductive circuit part and a pillar part are integrally combined of the present invention comprises: a sensitizer coating process of coating a conductive substrate with a sensitizer; an exposure process of forming a pillar part and non-pillar part by irradiating light through a film in which a pattern is formed on the sensitizer; a space part formation process of forming a space part by removing the non-pillar part; a circuit part formation part of forming a conductive circuit part in the space part through a coating process; a nonconductive support plate adhesion process of attaching the pillar part and the conductive circuit part to the conductive support plate; and a conductive substrate removal process of removing the conductive substrate.
