发明名称 SURFACE-TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a surface-treatment apparatus, which is enabled to reduce the size, to improve plating quality and to reduce an amount of plating solution.SOLUTION: A tank 100 comprises: a liquid receiver 2 for receiving a treating liquid Q having fallen along a plate-shaped work 10; a liquid-residence portion 4 for causing the treating liquid Q to be brought into abutment against the plate-shaped work 10; and a liquid outflow portion 6 for causing the treating liquid Q having flowed over and down from the liquid-residence portion 4, to flow down toward the plate-shaped work 10. The liquid outflow portion 6 is constituted to protrude a leading end 6a from a connection portion 5 of the liquid-residence portion 4 to the side wall 4a (or the side wall 2a of the liquid receiver 2) of the liquid residence portion 4.
申请公布号 JP2014043613(A) 申请公布日期 2014.03.13
申请号 JP20120186448 申请日期 2012.08.27
申请人 C UYEMURA & CO LTD 发明人 HOTTA TERUYUKI;YAMAMOTO HISAMITSU;UCHIUMI MASAYUKI;ISHIZAKI TAKAHIRO
分类号 C23C18/31;C25D17/00;C25D17/06;C25D17/08 主分类号 C23C18/31
代理机构 代理人
主权项
地址