发明名称 PACKAGING METHOD AND APPARATUS OF PHOSPHOR COATING LED
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive packaging method and an inexpensive packaging apparatus of a phosphor coating LED.SOLUTION: Multiple LEDs 110 are placed on an adhesive tape 105, and the adhesive tape is placed on a substrate 100. The substrate includes a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer coats the multiple LEDs. Subsequently, the phosphor layer is hardened. After the hardening of the phosphor layer, the tape and the substrate are removed. Then, an alternative tape is attached to the multiple LEDs. After the substrate is removed, a dicing process is performed to the multiple LEDs. The removed substrate is reused for another LED packaging process.
申请公布号 JP2014045194(A) 申请公布日期 2014.03.13
申请号 JP20130173717 申请日期 2013.08.23
申请人 TSMC SOLID STATE LIGHTING LTD 发明人 TSENG CHI-XIANG;YI HYO-MUN;WU MIN-SHENG;LIN TIEN-MING
分类号 H01L33/48;H01L33/50;H01L33/52 主分类号 H01L33/48
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